BDN15-3CB/A01
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HEATSINK CPU W/ADHESIVE 1.51"SQ |
Версия для печати
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
| Серия | BDN |
| Тип | Top Mount |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Shape | Square |
| Length | 1.51" (38.35mm) |
| Width | 1.510" (38.35mm) |
| Height Off Base (Height of Fin) | 0.355" (9.02mm) |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Thermal Resistance @ Forced Air Flow | 4.5°C/W @ 400 LFM |
| Thermal Resistance @ Natural | 15.1°C/W |
* Представленная техническая информация носит справочный характер и не
предназначена для использования в конструкторской документации.
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