HEATSINK LOW-PROFILE FORGED |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Серия | APF |
Тип | Top Mount |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method | Thermal Tape, Adhesive (Not Included) |
Shape | Square |
Length | 1.575" (40.01mm) |
Width | 1.575" (40.01mm) |
Height Off Base (Height of Fin) | 0.500" (12.70mm) |
Material | Aluminum |
Material Finish | Black Anodized |
Thermal Resistance @ Forced Air Flow | 1.9°C/W @ 200 LFM |
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