APF19-19-06CB
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HEATSINK LOW-PROFILE FORGED |
Версия для печати
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
| Серия | APF |
| Тип | Top Mount |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Shape | Square |
| Length | 0.748" (19.00mm) |
| Width | 0.748" (19.00mm) |
| Height Off Base (Height of Fin) | 0.250" (6.35mm) |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Thermal Resistance @ Forced Air Flow | 7.1°C/W @ 200 LFM |
* Представленная техническая информация носит справочный характер и не
предназначена для использования в конструкторской документации.
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