6230DG (COPPER)
|
BOARD LEVEL HEAT SINK
|
Версия для печати
Технические характеристики 6230DG (COPPER)
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
| Тип | Board Level, Vertical |
| Package Cooled | TO-220 |
| Attachment Method | Bolt On and PC Pin |
| Shape | Rectangular |
| Length | 1.180" (29.97mm) |
| Width | 1.000" (25.40mm) |
| Height Off Base (Height of Fin) | 0.500" (12.70mm) |
| Material | Copper |
| Material Finish | Tin |
| Power Dissipation @ Temperature Rise | 1W @ 20°C |
| Thermal Resistance @ Forced Air Flow | 6°C/W @ 300 LFM |
| Thermal Resistance @ Natural | 12.5°C/W |
* Представленная техническая информация носит справочный характер и не
предназначена для использования в конструкторской документации.
