THERMAL PAD SIL-PAD KA10 SIP |
Other Related Documents | Sil-Pad Metric Configurations |
Серия | Sil-Pad® KA-10 |
Usage | SIP |
Shape | Rectangular |
Outline | 36.83mm x 21.29mm |
Thickness | 0.006" (0.152mm) |
Material | Silicone Based |
Backing, Carrier | T-Film™ |
Цвет | Beige |
Thermal Conductivity | 1.3 W/m-K |
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